Kurzfassung: Discover the 12V9 150*20*31.75*10mm D30 C125 Resin Bond Diamond Grinding Wheel, designed for precision grinding of carbide tools, ceramic components, and semiconductor materials. This high-quality grinding wheel features diamond abrasives for ultra-hardness and wear resistance, with a resin binder for elasticity and heat dissipation. Perfect for tool grinders and cylindrical grinders.
Verwandte Produktmerkmale:
12V9 cup wheel shape for precision grinding applications.
150mm outer diameter (D) and 20mm thickness (T) for versatile use.
31.75mm inner hole diameter (H) ensures compatibility with standard machines.
10mm abrasive width (W) for precise material removal.
Die D30-Diamant-Schleifkörner (G) bieten eine hohe Härte und Verschleißbeständigkeit.
C125 diamond concentration (C) for optimal performance.
Resin binder (phenolic, polyimide, or epoxy) offers elasticity and heat dissipation.
Anpassbare Größen verfügbar, um spezifische Anforderungen zu erfüllen.
Fragen und Antworten:
Welche Materialien kann die 12V9 Harzbindung Diamant Schleifrad Prozess?
Diese Schleifscheibe ist ideal für die Bearbeitung von Hartmetallwerkzeugen, Keramikkomponenten und Halbleitermaterialien.
What machine tools are compatible with this grinding wheel?
It is suitable for use with tool grinders and cylindrical grinders.
Can the grinding wheel be customized to different sizes?
Yes, we offer customization for other sizes based on your specific requirements.