Kurzfassung: Discover the high-performance 1A1 75*6*32*19.05*10mm D100/120 Resin Bond Diamond Grinding Wheel, designed for precision grinding of hard materials like ceramics, glass, and cemented carbide. Learn about its features, applications, and customization options.
Verwandte Produktmerkmale:
High grinding efficiency with diamond abrasive for quick material removal.
Good self-sharpening due to resin binder wear, maintaining sharpness.
Low grinding temperature reduces thermal damage to workpieces.
High surface quality for precision machining with minimal chipping.
Lightweight design suitable for high-speed grinding operations.
Customizable sizes and specifications to meet specific needs.
Ideal for cemented carbide, ceramics, glass, and semiconductor materials.
Secure packaging ensures safe delivery and prevents damage.
Fragen und Antworten:
Welche Materialien kann die Harzbindung des Diamantschleifrads verarbeiten?
Es eignet sich für harte und zerbrechliche Materialien wie Keramik, Glas, Halbleiter und zentriertes Karbid.
Can the grinding wheel be customized to specific sizes?
Yes, we can customize dimensions, abrasive types, and concentrations based on your requirements.
How is the grinding wheel packaged for shipping?
Each wheel is packed in a sealed bag with bubble film, placed in a carton, and shipped via reliable couriers with tracking provided.